Innovations in Thin-Wall Molding Took Center Stage at INTERPLAST 2024.
Joinville, Brazil – August 13th – The future of lightweight, high-efficiency packaging and component manufacturing was on display as industry leaders converged at INTERPLAST 2024, which was held from August 13th to August 16th at the Expoville Convention Center. JINZHUO MOULD, a specialist in high-precision, thin-wall/preform/IML molding solutions, showcased its innovative technologies at the event.
This premier event dedicated significant focus to the advancing field of thin-wall molding, a critical technology for producing lighter and stronger products for the plastic packaging industry.
Key highlights include:
·South America has a vast industrial base and a growing demand for manufacturing. JINZHUO MOULD provided flexible and efficient customized mold solutions tailored to the specific needs and challenges of the South American market, helping customers enhance production efficiency and product competitiveness.
·We actively participated in key industrial and mold-related exhibitions across South America, where we showcased our corporate strengths and products and engaged in face-to-face communication with potential clients and industry peers.
"The drive towards lightweighting and sustainability is pushing the boundaries of what's possible in thin-wall molding," said Mr.Zhu, CEO at JINZHUO MOULD. "At this show, we're not just displaying molds; we're presenting integrated production solutions that help our clients reduce material usage, lower their carbon footprint, and achieve a significant competitive edge. We invite attendees to bring their toughest thin-wall challenges to our booth."
